Microelectronic Fabrication (EE 407)

2025 Fall
Faculty of Engineering and Natural Sciences
Electronics Engineering(EE)
3
6
Murat Kaya Yapıcı mkyapici@sabanciuniv.edu,
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English
Undergraduate
EE307 EL204
Formal lecture,Recitation,Group tutorial,Laboratory
Interactive,Communicative,Discussion based learning,Project based learning,Task based learning
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Programs\Type Required Core Elective Area Elective
Electronics Engineering *
Electronics Engineering *
Materials Science and Nano Engineering *
Materials Science and Nano Engineering (Previous Name: Materials Science and Engineering) *
Mechatronics Engineering *
Mechatronics Engineering *
Microelectronics *
Telecommunications *

CONTENT

Semiconductor growth; material characterization; lithography tools; photo-resist models; thin film deposition; chemical etching and plasma etching; electrical contact formation; microstructure processing; and process modeling.

OBJECTIVE

A detailed analysis of semiconductor processing technologies that form the basis for the physical realization of all semiconductor based device applications; from the realization of very large and ultra scale integrated circuits (VLSICs, ULSICs) and complex system-on-chip (SoC) application specific integrated circuits (ASICs) to individual device research and development in photonics, photonic integrated circuits (PICs), micro-electro-mechanical-systems (MEMS), etc. The primary objective of this course is to provide students with the fundamental understanding of standard unit processes involved in microfabrication, and providing familiarity with basic microfabrication tools. Although considerable focus will be given to Si-based microfabrication technologies, primarily because of its dominance in microelectronic industry today, the course material will be enriched with the cutting-edge compound semiconductor technologies (specifically GaAs/AlGaAs and InP/InGaAsP technologies) to provide a sound foundation for general semiconductor based fabrication, research and development.

LEARNING OUTCOMES

  • In depth understanding of the unit processes involved in IC fabrication, including diffusion, oxidation, ion implantation, lithography, dry/wet etching, physical and chemical vapor deposition techniques.
  • To learn the fundamental theory and operation of equipments used in different microelectronic processes.
  • Identify the performance metrics for each unit process, learn the governing equations to model each process, and how deviations from an ideal process affect device characteristics.
  • To learn about mask layout, and understand the reasons for layout rules in VLSI design.
  • Getting hands-on experience in the cleanroom and practicing the unit processes learned in class.
  • Learn about process modeling tools, device characterization and inspection techniques.
  • Develop an understanding of modern CMOS fabrication technology, learn about process integration, and be able to develop and understand fabrication flow diagrams.

PROGRAMME OUTCOMES

1. Understand the world, their country, their society, as well as themselves and have awareness of ethical problems, social rights, values and responsibility to the self and to others. 4

2. Understand different disciplines from natural and social sciences to mathematics and art, and develop interdisciplinary approaches in thinking and practice. 5

3. Think critically, follow innovations and developments in science and technology, demonstrate personal and organizational entrepreneurship and engage in life-long learning in various subjects; have the ability to continue to educate him/herself. 5

4. Communicate effectively in Turkish and English by oral, written, graphical and technological means. 3

5. Take individual and team responsibility, function effectively and respectively as an individual and a member or a leader of a team; and have the skills to work effectively in multi-disciplinary teams. 5

1. Possess sufficient knowledge of mathematics, science, fundamental engineering, computational methods and program-specific engineering topics; use theoretical and applied knowledge of these areas in complex engineering problems. 5

2. Identify, define, formulate and solve complex engineering problems while considering the UN Sustainable Development Goals; choose and apply suitable analysis, design, estimation/prediction and modeling methods for this purpose. 4

3. Develop, choose and use modern techniques and tools that are needed for analysis and solution of complex problems faced in engineering applications; use information technologies effectively. 5

4. Have the ability to design a complex system, process, instrument or a product under realistic constraints and conditions, with the goal of fulfilling creative current and future requirements. 5

5. Use research methods, including conducting literature reviews, designing experiments, performing experiments, collecting data, analyzing results, and interpreting results, to investigate complex engineering problems or discipline-specific research topics. 5

6. Possess knowledge of business practices such as project management, risk management, change management, and economic feasibility analysis; awareness on entrepreneurship and innovation. 4

7. Possess knowledge of impact of engineering solutions on society, health and safety, the economy, sustainability, and the environment within the framework of the UN Sustainable Development Goals; awareness on legal outcomes of engineering solutions; awareness of acting impartially and inclusively without any form of discrimination; act in accordance with ethical principles, possessing knowledge of professional and ethical responsibilities. 4

8. Communicate effectively, both orally and in writing, on technical subjects, considering the diverse characteristics of the target audience (such as education, language, and profession). 5

ASSESSMENT METHODS and CRITERIA

  Percentage (%)
Final 30
Midterm 30
Other 40

RECOMENDED or REQUIRED READINGS

Textbook

S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press
Readings

R. C. Jaeger, Introduction to Microelectronic Fabrication
J. D. Plummer, M. Deal, and P. B. Griffin, Silicon VLSI Technology, Prentice Hall
S. M. Sze, VLSI Technology, McGraw Hill