Semiconductor Process Technology (EE 533)

2022 Fall
Faculty of Engineering and Natural Sciences
Electronics Engineering(EE)
3
10
Murat Kaya Yapıcı mkyapici@sabanciuniv.edu,
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English
Doctoral, Master
--
Formal lecture,Recitation,Laboratory
Project based learning
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CONTENT

Theoretical analysis of the chemistry and physics of process technologies used in micro-electronics fabrication. Topics include semiconductor growth, material characterization, lithography tools, photo-resist models, thin film deposition, chemical etching, plasma etching, electrical contact formation, microstructure processing and process modeling.

OBJECTIVE

A detailed analysis of semiconductor processing technologies that form the basis for the physical realization of all semiconductor based device applications; from the realization of very large and ultra scale integrated circuits (VLSICs, ULSICs) and complex system-on-chip (SoC) application specific integrated circuits (ASICs) to individual device research and development in photonics, photonic integrated circuits (PICs), micro-electro-mechanical-systems (MEMS), etc. The primary objective of this course is to provide students with the fundamental understanding of standard unit processes involved in microfabrication, enforcing their experience with implementation projects in a microfabrication laboratory, and providing familiarity with basic microfabrication tools. Although considerable focus will be given to Si-based microfabrication technologies, primarily because of its dominance in microelectronic industry today, the course material will be enriched with the cutting-edge compound semiconductor technologies (specifically GaAs/AlGaAs and InP/InGaAsP technologies) to provide a sound foundation for general semiconductor based fabrication, research and development.

LEARNING OUTCOMES

  • Develop a working knowledge of the unit processes involved in IC fabrication
  • Learning the real structures of various semiconductor devices and the process flows for their physical realization
  • understanding the reasons for layout rules in VLSI design
  • Gaining hands-on experience in clean room
  • Obtaining an overall understanding of the roadmap of the semiconductor industry

ASSESSMENT METHODS and CRITERIA

  Percentage (%)
Final 35
Midterm 30
Written Report 35

RECOMENDED or REQUIRED READINGS

Textbook

S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press

Readings

R. C. Jaeger, Introduction to Microelectronic Fabrication
J. D. Plummer, M. Deal, and P. B. Griffin, Silicon VLSI Technology, Prentice Hall
S. M. Sze, VLSI Technology, McGraw Hill