Microelectronic Fabrication (EE 407)

2021 Fall
Faculty of Engineering and Natural Sciences
Electronics Engineering(EE)
6.00 / 6.00 ECTS (for students admitted in the 2013-14 Academic Year or following years)
Murat Kaya Yapıcı -mkyapici@sabanciuniv.edu,
EL204 EE307
Formal lecture,Recitation,Group tutorial,Laboratory
Interactive,Communicative,Discussion based learning,Project based learning,Task based learning
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Semiconductor growth; material characterization; lithography tools; photo-resist models; thin film deposition; chemical etching and plasma etching; electrical contact formation; microstructure processing; and process modeling.


A detailed analysis of semiconductor processing technologies that form the basis for the physical realization of all semiconductor based device applications; from the realization of very large and ultra scale integrated circuits (VLSICs, ULSICs) and complex system-on-chip (SoC) application specific integrated circuits (ASICs) to individual device research and development in photonics, photonic integrated circuits (PICs), micro-electro-mechanical-systems (MEMS), etc. The primary objective of this course is to provide students with the fundamental understanding of standard unit processes involved in microfabrication, and providing familiarity with basic microfabrication tools. Although considerable focus will be given to Si-based microfabrication technologies, primarily because of its dominance in microelectronic industry today, the course material will be enriched with the cutting-edge compound semiconductor technologies (specifically GaAs/AlGaAs and InP/InGaAsP technologies) to provide a sound foundation for general semiconductor based fabrication, research and development.


In depth understanding of the unit processes involved in IC fabrication, including diffusion, oxidation, ion implantation, lithography, dry/wet etching, physical and chemical vapor deposition techniques.
To learn the fundamental theory and operation of equipments used in different microelectronic processes.
Identify the performance metrics for each unit process, learn the governing equations to model each process, and how deviations from an ideal process affect device characteristics.
To learn about mask layout, and understand the reasons for layout rules in VLSI design.
Getting hands-on experience in the cleanroom and practicing the unit processes learned in class.
Learn about process modeling tools, device characterization and inspection techniques.
Develop an understanding of modern CMOS fabrication technology, learn about process integration, and be able to develop and understand fabrication flow diagrams.


  Percentage (%)
Midterm 50
Written Report 50



S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press


R. C. Jaeger, Introduction to Microelectronic Fabrication
J. D. Plummer, M. Deal, and P. B. Griffin, Silicon VLSI Technology, Prentice Hall
S. M. Sze, VLSI Technology, McGraw Hill