This course cover techniques in numerical analysis such as numerical solution of linear systems, sparse matrix techniques, linear least squares, singular value decomposition, numerical computation of eigenvalues and eigenvectors, optimization techniques, interpolation and approximation of functions, solving systems of nonlinear equations, numerical handling of ordinary and partial differential equations.
Numerical Methods (CS 505)
2014 Fall
Faculty of Engineering and Natural Sciences
Computer Sci.& Eng.(CS)
3
10
İbrahim Kürşat Şendur sendur@sabanciuniv.edu,
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English
Doctoral, Master
--
Formal lecture,Workshop
Simulation
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Programs\Type | Required | Core Elective | Area Elective |
Computer Science and Engineering - With Bachelor's Degree | * | ||
Computer Science and Engineering - With Master's Degree | * | ||
Computer Science and Engineering - With Thesis | * | ||
Cyber Security - With Bachelor's Degree | * | ||
Cyber Security - With Master's Degree | * | ||
Cyber Security - With Thesis | * | ||
Electronics Engineering and Computer Science - With Bachelor's Degree | * | ||
Electronics Engineering and Computer Science - With Master's Degree | * | ||
Electronics Engineering and Computer Science - With Thesis | * | ||
Electronics Engineering - With Bachelor's Degree | * | ||
Electronics Engineering - With Master's Degree | * | ||
Electronics Engineering - With Thesis | * | ||
Energy Technologies and Management-With Thesis | * | ||
Industrial Engineering - With Bachelor's Degree | * | ||
Industrial Engineering - With Master's Degree | * | ||
Industrial Engineering - With Thesis | * | ||
Leaders for Industry Biological Sciences and Bioengineering - Non Thesis | * | ||
Leaders for Industry Computer Science and Engineering - Non Thesis | * | ||
Leaders for Industry Electronics Engineering and Computer Science - Non Thesis | * | ||
Leaders for Industry Electronics Engineering - Non Thesis | * | ||
Leaders for Industry Industrial Engineering - Non Thesis | * | ||
Leaders for Industry Materials Science and Engineering - Non Thesis | * | ||
Leaders for Industry Mechatronics Engineering - Non Thesis | * | ||
Manufacturing Engineering - Non Thesis | * | ||
Manufacturing Engineering - With Bachelor's Degree | * | ||
Manufacturing Engineering - With Master's Degree | * | ||
Manufacturing Engineering - With Thesis | * | ||
Materials Science and Nano Engineering-(Pre:Materials Science and Engineering) | * | ||
Materials Science and Nano Engineering-(Pre:Materials Science and Engineering) | * | ||
Materials Science and Nano Engineering - With Thesis (Pre.Name: Materials Science and Engineering) | * | ||
Mechatronics Engineering - With Bachelor's Degree | * | ||
Mechatronics Engineering - With Master's Degree | * | ||
Mechatronics Engineering - With Thesis | * | ||
Molecular Biology, Genetics and Bioengineering (Prev. Name: Biological Sciences and Bioengineering) | * | ||
Molecular Biology, Genetics and Bioengineering-(Prev. Name: Biological Sciences and Bioengineering) | * | ||
Molecular Biology,Genetics and Bioengineering-With Thesis (Pre.Name:Biological Sciences and Bioeng.) | * | ||
Physics - Non Thesis | * | ||
Physics - With Bachelor's Degree | |||
Physics - With Master's Degree |
CONTENT
OBJECTIVE
Learning methods to solve partial differential equations using finite difference methods; to solve linear and nonlinear ordinary differential equations with single, multistep, and nonlinear methods by analyzing consistency, stability of the methods.
LEARNING OUTCOMES
- Apply the basic numerical concepts such as error analysis, round off error, subtractive cancellation, and error magnification.
- Apply fundamental numerical analysis tools and identify their limitations.
- Apply these basic numerical principles to model and analyze engineering problems.
- Gain hand on experience by developing computational tools for applied numerical problems.
Update Date:
ASSESSMENT METHODS and CRITERIA
Percentage (%) | |
Midterm | 40 |
Participation | 10 |
Individual Project | 50 |
RECOMENDED or REQUIRED READINGS
Textbook |
Numerical Analysis, J. Douglas Faires and Richard L. Burden, Thomson Press. |