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Code EE 407
Term 201701
Title Microelectronic Fabrication
Faculty Faculty of Engineering and Natural Sciences
Subject Electronics Engineering(EE)
SU Credit 3
ECTS Credit 6.00 / 6.00 ECTS (for students admitted in the 2013-14 Academic Year or following years)
Instructor(s) Murat Kaya Yap?c? -mkyapici@sabanciuniv.edu,
Language of Instruction English
Level of Course Undergraduate
Type of Course Click here to view.
Prerequisites
(only for SU students)
EL204 EE307
Mode of Delivery Formal lecture,Recitation,Group tutorial,Laboratory
Planned Learning Activities Interactive,Communicative,Discussion based learning,Project based learning,Task based learning
Content

Semiconductor growth; material characterization; lithography tools; photo-resist models; thin film deposition; chemical etching and plasma etching; electrical contact formation; microstructure processing; and process modeling.

Objective

A detailed analysis of semiconductor processing technologies that form the basis for the physical realization of all semiconductor based device applications; from the realization of very large and ultra scale integrated circuits (VLSICs, ULSICs) and complex system-on-chip (SoC) application specific integrated circuits (ASICs) to individual device research and development in photonics, photonic integrated circuits (PICs), micro-electro-mechanical-systems (MEMS), etc. The primary objective of this course is to provide students with the fundamental understanding of standard unit processes involved in microfabrication, and providing familiarity with basic microfabrication tools. Although considerable focus will be given to Si-based microfabrication technologies, primarily because of its dominance in microelectronic industry today, the course material will be enriched with the cutting-edge compound semiconductor technologies (specifically GaAs/AlGaAs and InP/InGaAsP technologies) to provide a sound foundation for general semiconductor based fabrication, research and development.

Learning Outcome

In depth understanding of the unit processes involved in IC fabrication, including diffusion, oxidation, ion implantation, lithography, dry/wet etching, physical and chemical vapor deposition techniques.
To learn the fundamental theory and operation of equipments used in different microelectronic processes.
Identify the performance metrics for each unit process, learn the governing equations to model each process, and how deviations from an ideal process affect device characteristics.
To learn about mask layout, and understand the reasons for layout rules in VLSI design.
Getting hands-on experience in the cleanroom and practicing the unit processes learned in class.
Learn about process modeling tools, device characterization and inspection techniques.
Develop an understanding of modern CMOS fabrication technology, learn about process integration, and be able to develop and understand fabrication flow diagrams.

Programme Outcomes
 
Common Outcomes For All Programs
1 Understand the world, their country, their society, as well as themselves and have awareness of ethical problems, social rights, values and responsibility to the self and to others. 4
2 Understand different disciplines from natural and social sciences to mathematics and art, and develop interdisciplinary approaches in thinking and practice. 5
3 Think critically, follow innovations and developments in science and technology, demonstrate personal and organizational entrepreneurship and engage in life-long learning in various subjects. 5
4 Communicate effectively in Turkish and English by oral, written, graphical and technological means. 3
5 Take individual and team responsibility, function effectively and respectively as an individual and a member or a leader of a team; and have the skills to work effectively in multi-disciplinary teams. 5
Common Outcomes ForFaculty of Eng. & Natural Sci.
1 Possess sufficient knowledge of mathematics, science and program-specific engineering topics; use theoretical and applied knowledge of these areas in complex engineering problems. 5
2 Identify, define, formulate and solve complex engineering problems; choose and apply suitable analysis and modeling methods for this purpose. 4
3 Develop, choose and use modern techniques and tools that are needed for analysis and solution of complex problems faced in engineering applications; possess knowledge of standards used in engineering applications; use information technologies effectively. 5
4 Ability to design a complex system, process, instrument or a product under realistic constraints and conditions, with the goal of fulfilling specified needs; apply modern design techniques for this purpose. 5
5 Design and conduct experiments, collect data, analyze and interpret the results to investigate complex engineering problems or program-specific research areas. 5
6 Knowledge of business practices such as project management, risk management and change management; awareness on innovation; knowledge of sustainable development. 4
7 Knowledge of impact of engineering solutions in a global, economic, environmental, health and societal context; knowledge of contemporary issues; awareness on legal outcomes of engineering solutions; understanding of professional and ethical responsibility. 4
Mechatronics Engineering Program Outcomes Core Electives
1 Familiarity with concepts in statistics and optimization, knowledge in basic differential and integral calculus, linear algebra, differential equations, complex variables, multi-variable calculus, as well as physics and computer science, and ability to use this knowledge in modeling, design and analysis of complex dynamical systems containing hardware and software components. 3
2 Ability to work in design, implementation and integration of engineering applications, such as electronic, mechanical, electromechanical, control and computer systems that contain software and hardware components, including sensors, actuators and controllers. 5
Materials Science and Nano Engineering Program Outcomes Core Electives
1 Applying fundamental and advanced knowledge of natural sciences as well as engineering principles to develop and design new materials and establish the relation between internal structure and physical properties using experimental, computational and theoretical tools. 4
2 Merging the existing knowledge on physical properties, design limits and fabrication methods in materials selection for a particular application or to resolve material performance related problems. 5
3 Predicting and understanding the behavior of a material under use in a specific environment knowing the internal structure or vice versa. 4
Electronics Engineering Program Outcomes Core Electives
1 Use mathematics (including derivative and integral calculations, probability and statistics), basic sciences, computer and programming, and electronics engineering knowledge to design and analyze complex electronic circuits, instruments, software and electronics systems with hardware/software. 5
2 Analyze and design communication networks and systems, signal processing algorithms or software using advanced knowledge on differential equations, linear algebra, complex variables and discrete mathematics. 2
Assessment Methods and Criteria
  Percentage (%)
Final 35
Midterm 30
Term-Paper 10
Group Project 25
Recommended or Required Reading
Textbook

S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press

Readings

R. C. Jaeger, Introduction to Microelectronic Fabrication
J. D. Plummer, M. Deal, and P. B. Griffin, Silicon VLSI Technology, Prentice Hall
S. M. Sze, VLSI Technology, McGraw Hill