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Code EL 407
Term 201401
Title Microelectronic Fabrication
Faculty Faculty of Engineering and Natural Sciences
Subject Microelectronics(EL)
SU Credit 3
ECTS Credit 6.00 / 6.00 ECTS (for students admitted in the 2013-14 Academic Year or following years)
Instructor(s) Volkan Husnu Ozguz vozguz@sabanciuniv.edu,
Detailed Syllabus
Language of Instruction English
Level of Course Undergraduate
Type of Course Click here to view.
Prerequisites
(only for SU students)
EL204
Mode of Delivery Formal lecture,Recitation,Group tutorial,Laboratory
Planned Learning Activities Interactive,Communicative,Discussion based learning,Project based learning,Task based learning
Content

Semiconductor growth; material characterization; lithography tools; photo-resist models; thin film deposition; chemical etching and plasma etching; electrical contact formation; microstructure processing; and process modeling.

Objective

A detailed analysis of semiconductor processing technologies that form the basis for the physical realization of all semiconductor based device applications; from the realization of very large and ultra scale integrated circuits (VLSICs, ULSICs) and complex system-on-chip (SoC) application specific integrated circuits (ASICs) to individual device research and development in photonics, photonic integrated circuits (PICs), micro-electro-mechanical-systems (MEMS), etc. The primary objective of this course is to provide students with the fundamental understanding of standard unit processes involved in microfabrication, and providing familiarity with basic microfabrication tools. Although considerable focus will be given to Si-based microfabrication technologies, primarily because of its dominance in microelectronic industry today, the course material will be enriched with the cutting-edge compound semiconductor technologies (specifically GaAs/AlGaAs and InP/InGaAsP technologies) to provide a sound foundation for general semiconductor based fabrication, research and development.

Learning Outcome

In depth understanding of unit processes involved in micro/nano fabrication
Understanding the reasons for layout rules in VLSI design
Getting hands-on experience in the cleanroom

Programme Outcomes
 
Common Outcomes For All Programs
1 Understand the world, their country, their society, as well as themselves and have awareness of ethical problems, social rights, values and responsibility to the self and to others. 5
2 Understand different disciplines from natural and social sciences to mathematics and art, and develop interdisciplinary approaches in thinking and practice. 5
3 Think critically, follow innovations and developments in science and technology, demonstrate personal and organizational entrepreneurship and engage in life-long learning in various subjects. 5
4 Communicate effectively by oral, written, graphical and technological means and have competency in English. 3
5 Take individual and team responsibility, function effectively and respectively as an individual and a member or a leader of a team. 5
Common Outcomes ForFaculty of Eng. & Natural Sci.
1 Possess and apply knowledge of mathematics, science, and engineering. 5
2 Design and conduct research, do experiments, as well as analyze and interpret data. 5
3 Identify, formulate, and solve engineering problems. 5
4 Use the techniques, skills, and modern engineering tools necessary for engineering practice. 5
5 Analyze, design and model engineering systems, components and processes. 5
Materials Science and Nano Engineering Program Outcomes Core Electives
1 Applying fundamental and advanced knowledge of natural sciences as well as engineering principles to develop and design new materials and establish the relation between internal structure and physical properties using experimental, computational and theoretical tools. 5
2 Merging the existing knowledge on physical properties, design limits and fabrication methods in materials selection for a particular application or to resolve material performance related problems. 5
3 Predicting and understanding the behavior of a material under use in a specific environment knowing the internal structure or vice versa. 1
Electronics Engineering Program Outcomes Core Electives
1 Use mathematics (including derivative and integral calculations, probability and/or statistics), basic sciences, computer and programming, and electronics engineering knowledge to design and analyze complex electronic circuits, instruments, software and electronics systems with hardware/software. 5
2 Analyze and design communication networks and systems, signal processing algorithms or software using advanced knowledge on differential equations, linear algebra, complex variables and discrete mathematics. 5
Mechatronics Engineering Program Outcomes Core Electives
1 In addition to basic differential and integral calculus, demonstrate knowledge in advanced mathematical topics such as linear algebra, differential equations, complex variables, multivariable calculus, as well as computer science and physics, and use such knowledge in the design and analysis of complex systems containing hardware and software components. 2
2 Apply modeling, instrumentation, software, and experimental techniques and their combinations in the design, realization and integration of systems such as electrical, electronic, control, mechanical and heat transfer systems. 1
Assessment Methods and Criteria
  Percentage (%)
Final 25
Midterm 25
Term-Paper 25
Group Project 25
Recommended or Required Reading
Textbook

R. C. Jaeger, Introduction to Microelectronic Fabrication
J. D. Plummer, M. Deal, and P. B. Griffin, Silicon VLSI Technology, Prentice Hall

Readings

S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press
S. M. Sze, VLSI Technology, McGraw Hill